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Technical SpecificationRemark
Layer1～16
Finished Board Thickness 0.40 mm-3.20 mm (16 mil- 128mil)
Min core material thickness0.1mm (4 mil)
Copper thicknessmin: 1/3 oz (base), max: 4 oz (finished)
Min line
width/space		Double side0.075 mm ( 3 mil )-Hoz
Multi-layer0.075 mm ( 3 mil )-Hoz
Min hole sizeDrilling holeφ0.2 mm ( 8mil, drill bit )
Punch holeφ0.80 mm ( 32 mil )
TolranceHole location Tolrance± 0.075 mm ( 3 mil )
Circuit width Tolrance± 20%(Nomal) or ± 10%(Special control)
Hole sizeNPTH: ± 0.03 mm ( 1.2 mil )
PTH: ± 0.076mm(3mil Normal)
       or  ±0.05 mm(2mil Special)
Outline Tolerance± 0.10 mm ( 4 mil )
Circuit to edge Tolerance± 0.15 mm ( 6 mil )
Warpage≤0.75%(Normal)  or ≤0.5%(Special control)
Surface treatmentImmersion Au/Silver/Tin
OSP/LF-HASL		Carbon ink, Peelable mask
V-CutMin board Thickness0.40 mm (16mil)
Min remain Thickness0.20 mm (8mil)
Tolerance± 0.1 mm (4mil)
Min space between hole edge and circuit
PTH hole: 0.13mm (5mil)
NPTH hole: 0.18mm (7mil)
Position Tolerance
between circuit and hole		Circuit to hole± 0.075mm (3mil)
Circuit to the second drill hole± 0.10mm (4mil)
Position Tolerance of circuit between different layers(relative position between top and bottom circuit)0.075mm (3mil)
MultilayerMin space between circuit and edge of inner layer0.225mm (9mil)
Min board thickness4 layers: 0.35mm (14mil)
6 layers: 0.65mm (26mil)
8 layers: 1.00mm (40mil) 
10 layers: 1.30mm (51mil)
12 layers: 1.60mm (63mil) 
Board thickness tolerance4 layers: +/-0.13mm (5mil)
6 layers: +/-0.13mm (5mil)
8 layers: +/-0.15mm (6mil)
10 layers: +/-0.15mm (6mil)
12 layers: +/-0.20mm (8mil)
Impedance Control Tolerance +/-10%